Vision Systems Simplifying power supply design for auto camera systems
Renesas Electronics has created the SL78083, a new type of highly integrated power management IC (PMIC) that simplifies power supply design for automotive surround-view camera systems.
With mobility as a service (MaaS) and vehicle rental solution winning more ground as car ownership is decreasing, dash-cameras are starting to gain real traction. A surge in popularity and leaps in technology have led to a drop in both price and size.
Renesas Electronics, a premier supplier of advanced semiconductor solutions, has created the ISL78083, a highly integrated power management IC (PMIC) that simplifies power supply in ever-shirnking HD camera modules. With this PMIC, Renesas Electronics expands its support for automotive surround-view and rearview camera systems beyond the image-processing functions of the R-Car SoC.
ISL78083 PMIC ideal for HD cameras used for environment detection
Renesas Electronics' new ISL78083 PMIC is compatible with HD cameras used in vehicles for, for example, environment detection systems.
"Cameras designed with the ISL78083 are smaller and can be conveniently mounted in-vehicle locations that provide the desired surround-view camera angles without negatively impacting style or aerodynamics," says Niall Lyne, Senior Director, Automotive Business Unit at Renesas.
Powered directly from the battery (36 to 42 V) or power-over-coax (15 to 18V), the ISL78083 supports output currents up to 750 mA per output. The power stage offers ample capacity for existing image sensors with up to 7 megapixels and will be able to handle future sensors with even higher resolution.
Lower BOM costs and effective Overvoltage/Undervoltage monitoring
The ISL78083 features four Overvoltage (OV) and four Undervoltage (UV) monitors, three power-good signal outputs, and a reset output/fault indicator. ISL78083 includes a second reference circuit for Overvoltage/Undervoltage monitoring.
The ISL78083's 4- × 4-mm, 24-pin SCQFN package improves solder joint reliability and allows for optical inspection of solder joints to help lower the cost of manufacturing. This chip reduces development time and bill of materials (BOM) costs and helps minimize supply-chain risks.